New proof of concept workpublished in a magazine materials horizonpaving the way for self-assembly of more complex electronic devices without relying on existing computer chip manufacturing techniques.
Bottom-up nano-to-microfabrication is of critical importance in modern electronics and optics. However, conventional multiscale array manufacturing techniques face the challenge of reconciling the conflict between the pursuit of better device performance and lower manufacturing costs and/or energy consumption. Chan others. We introduce a facile method for fabricating mixed-metal arrays based on directed self-assembly in which organometallic adducts derived from passivating oxides of ternary liquid metals are polymerized to fabricate mixed-metal wires. Image credit: Julia Chan.
“Existing chip manufacturing techniques involve many steps and rely on highly complex technology, making the process costly and time-consuming,” said Martin Tuo, a professor at North Carolina State University.
“Our self-assembly approach is significantly faster and cheaper.”
“We also demonstrated that this process can be used to tune the bandgap of semiconductor materials and make the materials responsive to light. This means this technique can be used to create optoelectronic devices. ”
“Furthermore, current manufacturing techniques have low yields, resulting in a relatively large number of unusable and defective chips being produced.”
“Our approach is high-yielding, meaning we produce arrays more consistently and with less waste.”
“We call this new self-assembly technique the directed metal-ligand (D-Met) reaction. Here's how it works,” he added.
“We start with liquid metal particles. In our proof-of-concept work, we used field metals, which are alloys of indium, bismuth, and tin.”
“Liquid metal particles are placed next to a mold and can be made into any size or pattern. A solution is then poured into the liquid metal.”
“The solution contains molecules called ligands, which are made up of carbon and oxygen.”
“These ligands collect ions from the surface of the liquid metal and hold them in a specific geometric pattern.”
“The solution flows across the liquid metal particles and is drawn into the mold.”
As the solution flows into the mold, the ion-containing ligands begin to assemble, forming more complex 3D structures.
Meanwhile, the liquid part of the solution begins to evaporate, which causes the complex structures to become more and more tightly packed into the array.
“Without a type, these structures can form somewhat chaotic patterns,” Professor Tusiad says.
“But because solutions are constrained by type, structures form in predictable, symmetrical arrangements.”
“Once the structure reaches the desired size, we remove the mold and heat the array.”
“This heat causes the ligand to decompose, liberating carbon and oxygen atoms.”
“Metal ions interact with oxygen to form semiconducting metal oxides, and carbon atoms form graphene sheets.”
“These components form an ordered structure consisting of semiconducting metal oxide molecules wrapped in graphene sheets.”
Professor Thuo and his colleagues used this technique to create nanoscale and microscale transistors and diodes.
“Graphene sheets can be used to tune the bandgap of a semiconductor, making the semiconductor more or less responsive depending on the quality of the graphene,” said Dr. Julia Zhang, a postdoctoral researcher at North Carolina State University. Ta.
Additionally, the researchers used bismuth in their proof-of-concept work, which allowed them to create photoresponsive structures.
This allows the authors to use light to manipulate the properties of semiconductors.
“The nature of D-Met technology means that these materials can be manufactured on a large scale, limited only by the size of the molds used,” Professor Thuo said.
“By manipulating the type of liquid used in the solution, the dimensions of the mold, and the rate of evaporation of the solution, we can also control the semiconductor structure.”
“In short, we have shown that highly structured and highly tunable electronic materials can be self-assembled for use in functional electronic devices.”
“This research demonstrated the creation of transistors and diodes.”
“The next step is to use this technology to create more complex devices, such as 3D chips.”
_____
Julia J. Chan others. guided infinitely Assemble mixed metal oxide arrays from liquid metals. materials horizonpublished online on November 25, 2024. doi: 10.1039/D4MH01177E
This article is a version of a press release provided by North Carolina State University.
Source: www.sci.news
